FLINGO brings together leading representatives from academia, SMEs and industry to explore and develop various surface and coating technologies (Sol-Gel, ALD, spray pyrolysis) for LED applications. Highly transparent conductive layers for electrical contacts in the optical path, inorganic matrix materials for extending the operating range of optical converters and ultrathin, chemically stable passivation layers for electrical insulation & barrier properties are key technologies to enable future optoelectronic devices. A number of promising new nanomaterials (e.g. Quantum Dots, nanorod-LEDs) are currently limited for mass production by either process constraints and/or operating lifetime instability. Combining such technologies with compatible coating technologies would enable these materials to be used in LED products and to extend their operating range. FLINGO aims to develop novel processes and materials to satisfy the extreme demands on the optical, electrical and mechanical performance while achieving conformal deposition and planarization that is compatible with large volume production in the opto-electronic industry.  


FLINGO aims for novel multi-functional layer stacks keeping the capability of serving for more than one function (e.g. combination of current spreading layer and barrier layer against moisture and corrosive gases), what will be addressed by a smart combination of various deposition techniques and the development of new processes enabling the deposition of novel materials (for given deposition technology). The combination of different functionality directly on chip has distinct advantages in terms of cost, dimension and scalability of process.


The major objective of the project is to explore deposition technologies (ALD, spray pyrolysis and sol-gel) with respect to extreme and challenging requirements in high quality LEDs, such as e.g., highly transparent and conductive p-type contacts, dense barrier layers for protection against environmental influences, extremely thin and conformal passivation layers for electrical insulation, etc. pp.). The innovation is to extend the application of the technologies to a novel quality in order to create new functionalities and to deposit materials typically associated with other techniques and properties. A unique approach by this project is the exploration of novel multi-layer stacks to modify surfaces and interfaces that becomes possible only by the smart combination of the explored deposition technologies. In doing so, advantageous process parameters (e.g. lower temperatures, less physical damage, less raw material usage, etc.) are envisioned enabling significant modifications in the LED chip process chain. This will lead to improved performance, enlarged life time, enhanced efficiency of resource consumption, and eventually to cost reduction. These goals are directly in line with the planned exploitation, where the focus is on manufacturability of each process and of combination of various processes and materials. Manufacturability is not limited to cost efficiency and to the capability of scaling up, but also to the usage of hazardous-free materials and the compatibility to an opto-electronic production environment. Another important objective is to insure the exploitation not only for the end-user, but also along the entire value chain, from basic and applied academic research to SMEs and industry. Whereas FLINGO will enable the latter to develop processes and tools being of high appreciation also in the photonic and electronic industry, the academic partner will strengthen their bonds to companies, and moreover, a spin-off company may be created as an outcome of this project.